View TDA1517N3_6824120.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

d a t a sh eet product specification supersedes data of 2002 jan 17 2004 feb 18 integrated circuits tda1517; tda1517p 2 x 6 w stereo power amplifier
2004 feb 18 2 nxp semiconductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p features ? requires very few external components ? high output power ? fixed gain ? good ripple rejection ? mute/standby switch ? ac and dc short-circuit safe to ground and v p ? thermally protected ? reverse polarity safe ? capability to handle high energy on outputs (v p =0v) ? no switch-on/switch-off plop ? electrostatic discharge protection. general description the tda1517 is an integrated class-b dual output amplifier in a plastic single in-line medium power package with fin (sil9mpf), a plastic rectangular-bent single in-line medium power package with fin (rbs9mpf) or a plastic heat-dissipating dual in-line package (hdip18). the device is primarily developed for multi-media applications. quick reference data ordering information symbol parameter conditions min. typ. max. unit v p supply voltage 6.0 14.4 18.0 v i orm repetitive peak output current ?? 2.5 a i q(tot) total quiescent current ? 40 80 ma i sb standby current ? 0.1 100 a i sw switch-on current ?? 40 a | z i | input impedance 50 ?? k p o output power r l =4 ; thd = 0.5% ? 5 ? w r l =4 ; thd = 10% ? 6 ? w svrr supply voltage ripple rejection f i = 100 hz to 10 khz 48 ?? db cs channel separation 40 ?? db g v closed loop voltage gain 19 20 21 db v no(rms) noise output voltage (rms value) ? 50 ? v t c crystal temperature ?? 150 c type number package name description version tda1517/n3 sil9mpf plastic single in-line medium power package with fin; 9 leads sot110-1 tda1517/n3/s5 rbs9mpf plastic rectangular-bent single in-line medium power package with fin; 9 leads sot352-1 tda1517p hdip18 plastic heat-dissipating dual in-line package; 18 leads sot398-1
2004 feb 18 3 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p block diagram fig.1 block diagram. handbook, full pagewidth mute/stand-by switch input mlc351 output 1 15 k 15 k x 1 va stand-by switch v p mute switch stand-by reference voltage 18 k 18 k 2 k 60 k mute switch c m power stage 4 8 mute switch va va c m 2 k 60 k power stage 6 275 sgnd signal ground pgnd output 2 non-inverting input 1 non-inverting input 2 9 supply voltage ripple rejection output 3 1 tda1517 mute reference voltage input reference voltage v p power ground (substrate)
2004 feb 18 4 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p pinning symbol pin description ? inv1 1 non-inverting input 1 sgnd 2 signal ground svrr 3 supply voltage ri pple rejection output out1 4 output 1 pgnd 5 power ground out2 6 output 2 v p 7 supply voltage m/ss 8 mute/standby switch input ? inv2 9 non-inverting input 2 fig.2 pin configuration for sot110-1 and sot352-1. handbook, halfpage mlc352 1 2 3 4 5 6 7 8 9 p v out2 sgnd inv1 inv2 tda1517 out1 m/ss svrr pgnd fig.3 pin configuration for sot398-1. pins 10 to 18 should be connected to gnd or floating. handbook, halfpage mlc353 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 p v out2 sgnd inv1 inv2 tda1517p out1 m/ss svrr pgnd functional description the tda1517 contains two identical amplifiers with differential input stages. the gain of each amplifier is fixed at 20 db. a special feature of the device is the mute/standby switch which has the following features: ? low standby current (<100 a) ? low mute/standby switching current (low cost supply switch) ? mute condition.
2004 feb 18 5 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p limiting values in accordance with the absolute maximum rating system (iec 60134). thermal resistance symbol parameter conditions min. max. unit v p supply voltage operating ? 18 v no signal ? 20 v v p(sc) ac and dc short-ci rcuit safe voltage ? 18 v v p(r) reverse polarity ? 6v erg o energy handling capability at outputs v p =0v ? 200 mj i osm non-repetitive peak output current ? 4a i orm repetitive peak output current ? 2.5 a p tot total power dissipation see fig.4 ? 15 w t stg storage temperature ? 55 +150 c t amb operating ambient temperature ? 40 +85 c t c crystal temperature ? 150 c symbol type number parameter value unit r th(j-c) tda1517/n3; tda1517/n3/s5 thermal resistance from junction to case 8 k/w r th(j-p) tda1517p thermal resistance from junction to pins 15 k/w r th(j-a) tda1517/n3; tda1517/n3/s5; tda1517p thermal resistance from junction to ambient 50 k/w fig.4 power derating curve. (1) r th j-c =8k/w. (2) r th j-p =15k/w. handbook, halfpage 25 0 50 150 12 0 mlc354 100 t ( c) o amb p (w) 18 6 (1) (2)
2004 feb 18 6 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p dc characteristics v p =14.4v; t amb =25 c; measured in fig.6; unless otherwise specified. note 1. the circuit is dc adjusted at v p = 6 to 18 v and ac operating at v p = 8.5 to 18 v. symbol parameter conditions min. typ. max. unit supply v p supply voltage note 1 6.0 14.4 18.0 v i q(tot) total quiescent current ? 40 80 ma v o dc output voltage ? 6.95 ? v mute/standby switch v 8 switch-on voltage level see fig.5 8.5 ?? v mute condition v o output signal in mute position v i(max) =1v; f i =20hzto15khz ?? 2mv standby condition i sb dc current in standby condition ?? 100 a v sw switch-on current ? 12 40 a
2004 feb 18 7 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p ac characteristics v p =14.4v; r l =4 ; f = 1 khz; t amb =25 c; measured in fig.6; unless otherwise specified. notes 1. output power is measured directly at the output pins of the ic. 2. frequency response externally fixed. 3. ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 v (p-p) and a frequency between 100 hz and 10 khz. 4. noise voltage measured in a bandwidth of 20 hz to 20 khz. 5. noise output voltage independent of r s (v i =0v). symbol parameter conditions min. typ. max. unit p o output power thd = 0.5%; note 1 4 5 ? w thd = 10%; note 1 5.5 6.0 ? w thd total harmonic distortion p o =1w ? 0.1 ? % f lr low frequency roll-off at ? 3 db; note 2 ? 45 ? hz f hr high frequency roll-off at ? 1db 20 ?? khz g v closed loop voltage gain 19 20 21 db svrr supply voltage ripple rejection note 3 on 48 ?? db mute 48 ?? db standby 80 ?? db | z i | input impedance 50 60 75 k v no noise output voltage on r s =0 ; note 4 ? 50 ? v on r s =10 ; note 4 ? 70 100 v mute note 5 ? 50 ? v cs channel separation r s =10 40 ?? db | g v | channel unbalance ? 0.1 1 db
2004 feb 18 8 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p fig.5 standby, mute and on conditions. handbook, halfpage 8.5 0 mlc355 v 18 6.4 3.3 2 11 (v) on (i = 40 ma) p mute (i = 40 ma) p standby (i 100 a) p application information fig.6 application circuit diagram. handbook, full pagewidth mlc356 100 nf p v tda1517 87 standby switch 220 nf input 1 1000 f 1000 f input reference voltage 2 5 signal ground power ground 1 9 220 nf input 2 4 6 3 2200 f internal 1/2 v p 100 f 60 k 60 k 20 db 20 db
2004 feb 18 9 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p package outlines unit a a max. 2 a 3 b 1 d 1 b 2 bcd (1) e (1) z max. (1) elpp 1 q 1 q 2 q references outline version european projection issue date iec jedec jeita mm 18.5 17.8 3.7 8.7 8.0 a 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 q 1.75 1.55 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 sot110-1 95-02-25 03-03-12 0 5 10 mm scale 0.25 w d e a a c a 2 3 a 4 q 1 q 2 l q w m b b 1 b 2 d 1 p q 1 z e 19 p seating plane pin 1 index s il9mpf: plastic single in-line medium power package with fin; 9 leads sot110 -1
2004 feb 18 10 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p unit a a max. 2 max. a 3 b 1 d 1 b 2 bcd (2) e (2) z (2) (1) el pp 1 q 1 q 2 q references outline version european projection issue date iec jedec jeita mm 14.45 13.95 8.7 8.0 3.7 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1 5.9 5.7 4.4 4.2 3.8 3.3 15.1 14.9 q 1.75 1.55 dimensions (mm are the original dimensions) notes 1. dimension is specified at seating plane. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 sot352-1 97-12-16 03-03-12 0 5 10 mm scale 0.25 w 0.6 v d e a a c a 2 3 q 1 q 2 q d 1 p q 1 p seating plane pin 1 index l w m v m b b 1 b 2 z e 19 r bs9mpf: plastic rectangular-bent single in-line medium power package with fin; 9 leads sot352 -1
2004 feb 18 11 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l references outline version european projection issue date iec jedec jeita mm dimensions (inch dimensions are derived from the original mm dimensions) sot398-1 95-01-25 03-02-13 a min. a max. b max. w m e e 1 1.40 1.14 0.67 0.50 0.47 0.38 21.85 21.35 6.5 6.2 3.9 3.1 0.25 2.54 7.62 8.32 8.02 8.7 7.7 1 4.7 0.51 3.7 inches 0.06 0.04 0.03 0.02 0.02 0.01 1.05 0.75 0.04 0.03 0.87 0.84 0.26 0.24 0.15 0.12 0.01 0.1 0.3 0.33 0.32 0.34 0.30 0.04 0.19 0.02 0.15 m h c (e ) 1 m e w m b 1 b 2 e a a 1 a 2 l seating plane z d e 18 1 10 9 b pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. h dip18: plastic heat-dissipating dual in-line package; 18 leads sot398 -1
2004 feb 18 12 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p soldering introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our ?data handbook ic26; integrated circuit packages? (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. soldering by dipping or by solder wave driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. suitability of through-hole mount ic packa ges for dipping and wave soldering methods notes 1. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. for pmfp packages hot bar soldering or manual soldering is suitable. package soldering method dipping wave cpga, hcpga ? suitable dbs, dip, hdip, rdbs, sdip, sil suitable suitable (1) pmfp (2) ? not suitable
2004 feb 18 13 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semico nductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without lim itation - lost profits, lost savings, business interrup tion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semi conductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, lif e-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assi stance with ap plications or customer product design. it is customer?s sole responsibility to dete rmine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as for the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect.
2004 feb 18 14 nxp semico nductors product specification 2 x 6 w stereo power am plifier tda1517; tda1517p limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will c ause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeat ed exposure to lim iting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the general terms and conditions of comme rcial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semicond uctors? warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors? standard warranty and nxp semiconductors? product specifications.
nxp semiconductors provides high performance mixed signal and standard product solutions that leverage its leadi ng rf, analog, power management, interface, security and digital processing expertise contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2010 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors. no changes were made to the content, except for the legal definitions and disclaimers. printed in the netherlands r30/05/pp 15 date of release: 2004 feb 18 document order number: 9397 750 12926

▲Up To Search▲

Price & Availability of TDA1517N3

	To Download TDA1517N3 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .